1. 2. 3. material content data sheet sales product name tle42764e v50 issued 29. august 2013 ma# MA000970668 package pg-ssop-14-2 weight* 83.49 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 3.179 3.81 3.81 38077 38077 leadframe inorganic material phosphorus 7723-14-0 0.009 0.01 103 non noble metal zinc 7440-66-6 0.034 0.04 413 non noble metal iron 7439-89-6 0.689 0.83 8253 non noble metal copper 7440-50-8 27.978 33.51 34.39 335114 343883 wire noble metal gold 7440-57-5 0.109 0.13 0.13 1305 1305 encapsulation organic material carbon black 1333-86-4 0.096 0.12 1155 plastics epoxy resin - 4.434 5.31 53108 inorganic material silicondioxide 60676-86-0 43.664 52.30 57.73 523003 577266 leadfinish non noble metal tin 7440-31-5 0.976 1.17 1.17 11692 11692 plating noble metal silver 7440-22-4 0.768 0.92 0.92 9194 9194 glue plastics epoxy resin - 0.388 0.46 4646 noble metal silver 7440-22-4 1.164 1.39 1.85 13937 18583 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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